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中国精品科技期刊2020
刘莹, 许琳, 刘颖. 壳聚糖/香菇多糖可食性膜的性能研究及表征[J]. 食品工业科技, 2015, (12): 287-290. DOI: 10.13386/j.issn1002-0306.2015.12.052
引用本文: 刘莹, 许琳, 刘颖. 壳聚糖/香菇多糖可食性膜的性能研究及表征[J]. 食品工业科技, 2015, (12): 287-290. DOI: 10.13386/j.issn1002-0306.2015.12.052
LIU Ying, XU Lin, LIU Ying. Properties and characterization of chitosan/lentinan edible films[J]. Science and Technology of Food Industry, 2015, (12): 287-290. DOI: 10.13386/j.issn1002-0306.2015.12.052
Citation: LIU Ying, XU Lin, LIU Ying. Properties and characterization of chitosan/lentinan edible films[J]. Science and Technology of Food Industry, 2015, (12): 287-290. DOI: 10.13386/j.issn1002-0306.2015.12.052

壳聚糖/香菇多糖可食性膜的性能研究及表征

Properties and characterization of chitosan/lentinan edible films

  • 摘要: 采用壳聚糖为主要成膜材料,添加一种生物活性成分香菇多糖,以甘油为增塑剂,采用流延法制备新型的可食性复合膜。测定香菇多糖的含量对膜材料性能的影响,并对复合膜进行结构表征。结果表明,随着香菇多糖含量的增加,复合膜的抗拉强度从24.61MPa增加到32.14MPa、断裂延伸率从15.07%降低到4.57%;水溶性逐渐增加,最高时达7.04%;阻氧性先升高后趋于平稳,在香菇多糖含量为1.0%时最佳,过氧化值低至4.28g/100g;水蒸气透过率先降低后升高,在香菇多糖含量为0.75%时达到最小值0.1322g·mm/(m2·h·k Pa)。红外及XRD分析显示复合膜各组分良好相容。 

     

    Abstract: Chitosan was chosen as the main film-forming material, added a kind of biological active componentlentinan, with glycerol as the plasticizer, new types of edible composite film were prepared by blade casting process. The influence on composite films of lentinan content and structural characterization tested. Results show that the tensile strength (TS) of films improved from 24.61 MPa to 32.14 MPa with the increasing content of lentinan, while the elongation at break (E) decreased from 15.07% to 4.57%. The water solubility increased as the lentinan increasing, the maximum was 7.04%. The oxygen resistance increased in the initial stage until reaching the best at lentinan content of 1.0%, peroxide value of oil low to 4.28g/100 g, and then flatted. The water vapor permeability decreased in the initial stage until reaching the minimum 0.1322g·mm/ (m2·h·k Pa) at lentinan content of 0.75%, and then increased. IR and XRD analysis showed, that description of composite films had good compatibility between components.

     

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