Analysis of Fungal Contamination Risk in Pre-packaged Dried Soybean Curd Processing Line Based on High-throughput Sequencing Technology

In this study, the fungal contamination in pre-packaged dried soybean curd processing line were analyzed by high-throughput sequencing technology, in combination with culture methods. The contact surface and semi-finished products of food had obvious fungal contamination, Kodamaea, Candida, Trichosporon, Alternaria and Aspergillus were detected to be the predominant contaminating fungal. Boiling and terminal sterilization process efficiently reduce the viable microbial count in soybean curd product. Food contact surfaces showed higher community diversity and abundance than semi-finished products. Conveying tanks, the tofu-covering cloth, the alkaline denaturation tank inner wall, baking inner wall and packaging hopper inner wall were high-risk contact surfaces. Fungi were not the main cause of shelf life spoilage but might induce mycotoxin residues risk.